ULTRASONIC SOLDERING

Ultrasonic Soldering

ULTRASONIC SOLDERING

To clean the workpiece after ultrasonic soldering is not needed any more. Soldering take place without aggerssive flux and make it pissoble to solder materials as glass, ceramics or aluminium. For ultrasonic soldering, we offer outstanding soldering systems for a wide range of applications.

EXPLANATIAON
1. Ultrasonic vibrations in liquid solder blow away the oxide layer of the soldering surface.
2. On the cleaned area arises a reaction of the surface with the solder.
3. The ultrasonic vibrations presses the solder into hairline cracks, holes and micropores of the surface and seal it.
4. In solder trapped gases were removed by ultrasonic vibrations and a void-free soldering arises.
5. The surface to be soldered is increased and provides an increasing adhesion.

  • ADVANTAGES

    Ultrasonic soldering offers a wide range of advantages compared to conventional soldering methods.

    • Soldering of thin and difficult to solder materials as glas, ceramics, aluminium, steel etc.
    • Soldering without corrosion and flux
    • Subsequently cleaning is not applicable
    • Gas-tight and heat-resistand up to 250 centigrade

  • INDUSTRIES

    • Solar Industry ( Production and repairing of solar cells )
    • Optical Industry ( Tin optical glasses )
    • Electrical Industry ( Production of sensors and semiconductors )