ULTRASONIC SOLDERING SYSTEMS

Ultrasonic Soldering Systems

ULTRASONIC SOLDERING SYSTEMS

Mirtest Ultrasonic Soldering Systems, is optimized for ultrasonic soldering in a wide range of applications. In solar cell production for example, ultrasonic soldering makes it possible to reduce the costs of cell production and improve the cell performance at the same time. Moreover, it allows soldering a wide variety of materials such as ceramic, metals and glass. Mirtest Ultrasonic Soldering Systems is available in 3 different models : SS MR2 , SS MR3 , SS MR5

FUNCTIONS / EQUIPMENT FEATURESELECTRICAL DATA (all models)
Compact construction - autonomous deviceLine: 90 – 250 V / AC (wide range power supply with powerfactor correction)
integrated temperature-triggered fanLine Power Consumption: Approx. 100 VA
Frequency autotuningFrequency: 60 kHz +/- 2 kHz
Optional: Profibus-Interface: DPV0 ProtocolAmplitude: Adjustable amplitude 50 – 100 %
Access to all important generator functionsRF-Output Power: Maximal 15 W
Adjustable Bus address , SPS-InterfaceHeater Control: Max. temp. 450°C
Detachable handeld unit with LCD-DisplayHeater Control: Adjustable 150 – 450°C
Optional front LCD-Display with rotary encoderHeater Control: Adjustable standby delay and standby-temperature
Soldering Iron for robot applications, compressed air
cooling, LED-Indicators for heater and over temperature
Heater Power: Maximal 70 W
Adjustable heater, up to 450°C
Temperature control of the soldering iron, overtemperature security
Frontpanel with power-bargraph-display, status-display and test-button

SOLDERING IRON
Dimension (LxD) : Approx. 250 mm / max. 35 mm
Weight : Approx. 500 g
Protection : IP 20
Sonotrodes : Special steel, changeable
Connection : 8-pole connector
Integrated sensor for temperature control
Connector for pressurized air