ULTRASONIC SOLDERING SYSTEMS
Mirtest Ultrasonic Soldering Systems, is optimized for ultrasonic soldering in a wide range of applications. In solar cell production for example, ultrasonic soldering makes it possible to reduce the costs of cell production and improve the cell performance at the same time. Moreover, it allows soldering a wide variety of materials such as ceramic, metals and glass. Mirtest Ultrasonic Soldering Systems is available in 3 different models : SS MR2 , SS MR3 , SS MR5
FUNCTIONS / EQUIPMENT FEATURES | ELECTRICAL DATA (all models) |
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Compact construction - autonomous device | Line: 90 – 250 V / AC (wide range power supply with powerfactor correction) |
integrated temperature-triggered fan | Line Power Consumption: Approx. 100 VA |
Frequency autotuning | Frequency: 60 kHz +/- 2 kHz |
Optional: Profibus-Interface: DPV0 Protocol | Amplitude: Adjustable amplitude 50 – 100 % |
Access to all important generator functions | RF-Output Power: Maximal 15 W |
Adjustable Bus address , SPS-Interface | Heater Control: Max. temp. 450°C |
Detachable handeld unit with LCD-Display | Heater Control: Adjustable 150 – 450°C |
Optional front LCD-Display with rotary encoder | Heater Control: Adjustable standby delay and standby-temperature |
Soldering Iron for robot applications, compressed air cooling, LED-Indicators for heater and over temperature | Heater Power: Maximal 70 W |
Adjustable heater, up to 450°C | |
Temperature control of the soldering iron, overtemperature security | |
Frontpanel with power-bargraph-display, status-display and test-button |
SOLDERING IRON |
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Dimension (LxD) : Approx. 250 mm / max. 35 mm |
Weight : Approx. 500 g |
Protection : IP 20 |
Sonotrodes : Special steel, changeable |
Connection : 8-pole connector |
Integrated sensor for temperature control |
Connector for pressurized air |